Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding
-
Published:2024-03
Issue:
Volume:29
Page:5562-5575
-
ISSN:2238-7854
-
Container-title:Journal of Materials Research and Technology
-
language:en
-
Short-container-title:Journal of Materials Research and Technology
Author:
Wu Chuanjiang,
Zhang LiangORCID,
Sun Lei,
Lu Xiao,
Chen Chen
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献