Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques

Author:

Zhang Shuai,Jing Xinyi,Qiu Qingyang,Chen Jieshi,Paik Kyung-Wook,He Peng,Zhang Shuye

Publisher

Elsevier BV

Reference31 articles.

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3. Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD;Wang;J. Mater. Res. Technol.,2023

4. Recent advances in nano-materials for packaging of electronic devices;Zhang;J. Mater. Sci. Mater. Electron.,2019

5. Forming mechanism and growth of Kirkendall voids of Sn/cu joints for electronic packaging: a recent review;Wang;J. Adv. Joining Process.,2022

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