Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium
Author:
Funder
China Scholarship Council
Nihon Superior Co., Ltd
EPSRC
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference60 articles.
1. Cyclic twin nucleation in tin-based solder alloys;Lehman;Acta Mater.,2010
2. Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications;Anderson;J. Mater. Sci. Mater. Electron.,2007
3. Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders;Ma;J. Alloys Compd.,2016
4. The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue;Henderson;J. Mater. Res.,2004
5. The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints;Bieler;J. Electron. Mater.,2012
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