Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference22 articles.
1. Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions
2. Drop impact reliability of Sn–1.0Ag–0.5Cu BGA interconnects with different mounting methods
3. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
4. W. Kittidacha, A. Kanjanavikat, K. Vattananiyom, Effect of SAC Alloy Composition on Drop and Temp Cycle Reliability of BGA with NiAu Pad Finish, in: Proceedings of the 10th IEEE-EPTC Conference, 2008, p. 1074–1079.
5. A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints
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1. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties;Journal of Materials Research and Technology;2024-07
2. Taguchi Optimization of Wetting, Thermal and Mechanical Properties of Sn-1.0wt.%Ag-0.5wt.%Cu Alloys Modified with Bi and Sb;Materials;2024-06-01
3. Fracture behavior and constitutive relations of Sn-3.0Ag-0.5Cu solder alloy at cryogenic temperature;Materials Science and Engineering: A;2024-03
4. Corrosion problems of SAC-SiC composite solder alloys;Corrosion Science;2023-11
5. Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review;Advanced Engineering Materials;2023-07-26
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