Author:
Shnawah Dhafer Abdulameer,Sabri Mohd Faizul Mohd,Badruddin Irfan Anjum
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference77 articles.
1. Syed A, Scanlan J, Cha S, Kang W, Sohn E, Kim T, et al. Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions. In: Proc 58th IEEE-ECTC conf; 2008. p. 1453–61.
2. Frear DR, Ramanathan LN, Jang J-W, Owens NL. Emerging reliability challenges in electronic packaging. In: Proc 46th IEEE – annual international reliability physics symposium; 2008. p. 450–4.
3. Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact;Zhang;Microelectron Reliab,2009
4. Chong DYR, Ng K, Tan JYN, Low PTH, Pang JHL, Che FX, et al. Drop impact reliability testing for lead-free and leaded soldered IC packages. In: Proc 55th IEEE-ECTC conf; 2005. p. 622–9.
5. Mechanical characterization of Sn–Ag based lead-free solders;Amagai;Microelectron Reliab,2002
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