Author:
Wang Bo,Li Jiajun,Gallagher Anthony,Wrezel James,Towashirporn Pongpinit,Zhao Naiqin
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. Gray Gordon. Lead-free soldering for CSP. In: Proc IPC/JEDEC 5th international conference on lead free electronic components and assemblies, San Jose, CA; 2004.
2. Wong EH et al. Drop impact: fundamentals and impact characterization of solder joints. In: Proc 55th electronic components and technology conference; 2005. p. 455–67.
3. Darveaux Robert, Reichman Corey, Islam Nokibul. Interface failure in lead free solder joints. In: Proc 56th electronic components and technology conference; 2006. p. 906–17.
4. Interfacial reaction issues for lead-free electronic solders;Ho;J. Mater Sci: Mater Electron,2007
5. The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints;Liu;JOM,2007
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献