Fracture behavior and constitutive relations of Sn-3.0Ag-0.5Cu solder alloy at cryogenic temperature-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Fracture behavior and constitutive relations of Sn-3.0Ag-0.5Cu solder alloy at cryogenic temperature

Published:2024-03 Issue: Volume:896 Page:146280
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Li Shengli,Hang Chunjin^ORCID,Zhang Wei,Tian Yanhong,Yu Dan,Ding Ying,Wang Xiuli

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference54 articles.

1. Effect of Nd addition on the corrosion behavior of SAC305 solder alloy;Pan;Corrosion Sci.,2023

2. Morphologies and nucleus models of β-Sn grains in SAC305-xIn freestanding solder balls and solder joints;Ren;Mater. Char.,2023

3. Fatigue cracking growth of SAC305 solder ball under rapid thermal shock;Liu;Eng. Fract. Mech.,2022

4. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates;Li;Results Phys.,2018

5. Microstructure transformation and mechanical properties of Al alloy joints soldered with Ni-Cu foam/Sn-3.0Ag-0.5Cu (SAC305) composite solder;Xiong;J. Alloys Compd.,2022

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability and thermal fatigue life prediction of solder joints using nanoindentation;Materials Today Communications;2024-06

2. Mechanical properties and tribological behavior of Al0.5CoCrFeNb0.5Ni high-entropy alloy at high temperatures;Journal of Materials Research and Technology;2024-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP