Reliability and thermal fatigue life prediction of solder joints using nanoindentation
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference55 articles.
1. New challenges of miniaturization of electronic devices: electromigration and thermomigration in lead-free solder joints;Zhang;Mater. Des.,2020
2. Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution;Li;Int. J. Fatigue,2023
3. Solder joint failures under thermo-mechanical loading conditions – a review;Depiver;Adv. Mater. Process. Technol.,2021
4. Machine learning aided modelling of thermomechanical fatigue of solder joints in electronic component assemblies;Voet;Int. J. Fatigue,2023
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