Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation
Reference40 articles.
1. Fatigue properties of solder joints;Wild;Weld Res Suppl,1972
2. A damage integral approach to thermal fatigue of solder joints;Subrahmanyan;IEEE Trans Components Hybrids Manuf Technol,1989
3. Thermal cycling analysis of flip-chip solder joint reliability;Pang;IEEE Trans Components Pack Technol,2001
4. Reliability of lead-free solder joints in CSP device under thermal cycling;Zhang;J Mater Sci, Mater Electron,2014
5. Viscoplastic anand model for solder alloys and its application;Cheng;Soldering Surf Mount Technol,2000
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