Fatigue cracking growth of SAC305 solder ball under rapid thermal shock-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Fatigue cracking growth of SAC305 solder ball under rapid thermal shock

Published:2022-01 Issue: Volume:259 Page:108141
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Liu Cong,Xia Daquan,Tian Mizhe,Chen Shiqi,Gan Guisheng,Du Yunfei,Liu Xin,Jiang Zhaoqi,Wu Yiping,Ma Yanlong

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference56 articles.

1. Thermal fatigue and failure of electronic power device substrates;Pietranico;Int J Fatigue,2009

2. Reliability issues of lead-free solder joints in electronic devices;Jiang;Sci Technol Adv Mater,2019

3. Fracture behaviors of Sn-Cu intermetallic compound layer in ball grid array induced by thermal shock;Shen;J Electron Mater,2014

4. Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests;Laurila;Microelectron Reliab,2007

5. Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies;Tian;Microelectron Int,2020

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of BGA Lead-Free solder joints failure behavior based on thermal shock testing;Engineering Failure Analysis;2024-11

2. Atomistic investigation of pressure effects on sintering of bimetallic core–shell nanoparticles;Journal of Materials Science & Technology;2024-06

3. Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock;Transactions of Nonferrous Metals Society of China;2024-06

4. Thermal fatigue failure analysis and life assessment of Ni-based single crystal superalloys with film cooling holes;Engineering Fracture Mechanics;2024-05

5. Fracture behavior and constitutive relations of Sn-3.0Ag-0.5Cu solder alloy at cryogenic temperature;Materials Science and Engineering: A;2024-03

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3