Analysis of BGA Lead-Free solder joints failure behavior based on thermal shock testing
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Published:2024-11
Issue:
Volume:165
Page:108813
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ISSN:1350-6307
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Container-title:Engineering Failure Analysis
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language:en
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Short-container-title:Engineering Failure Analysis
Author:
Song Xiaoxiao,
Chen Yongxia,
Xiao Zewen,
Chen YajunORCID
Reference29 articles.
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3. Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test;Al Athamneh;Microelectron. Reliab.,2020
4. Effect of temperature on the low cycle fatigue properties of BGA solder joints;Wei;Microelectron. Reliab.,2023
5. Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging;Roumanille;Microelectron. Reliab.,2021