Author:
Wei Xin,Alahmer Ali,Ali Heneen,Tahat Sufyan,Vyas Palash Pranav,Hamasha Sa’d
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference59 articles.
1. Interpreting accelerated test results for lead free solder joints;Borgesen,2016
2. Effect of solder sphere alloys and surface finishes on the reliability of lead-free solder joints in accelerated thermal cycling;Akkara,2018
3. Effect of underfill property evolution on solder joint reliability in automotive applications;Lall,2022
4. Effect of surface finish and high bi solder alloy on component reliability in thermal cycling;Akkara,2018
5. Effect of the welding process on the microstructure and mechanical properties of Au/Sn–3.0 Ag–0.5 Cu/Cu solder joints;Zhai;J. Electron. Mater.,2022
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献