Funder
Shanghai Alliance Plan
the Science and Technology Planning Project of Zhejiang Province, China
Enterprise-funded Latitudinal Research Projects
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference42 articles.
1. M. Li, J. Zou, W. Wu, N. Jiang, Y. Liu, L. Wang, M. Shi, and W. Li, Analysis of high-temperature aging and microstructure of FC LED solder joints of a silver conductive layer bonded using SAC solder. J. Phys. 1074, 1742 (2018).
2. M. Hamidnia, Y. Luo, and X.D. Wang, Application of micro/nano technology for thermal management of high power LED packaging: a review. Appl. Therm. Eng. 145, 637 (2018).
3. A. Kroupa, D. Andersson, N. Hoo, J. Pearce, A. Watson, A. Dinsdale, and S. Mucklejohn, Current problems and possible solutions in high-temperature lead-free soldering. J. Mater. Eng. Perform. 21, 629 (2012).
4. B. Arfaei, N. Kim, and E.J. Cotts, Dependence of Sn grain morphology of Sn–Ag–Cu solder on solidification temperature. J. Electron Mater. 41, 362 (2012).
5. K. Mehrabi, F. Khodabakhshi, E. Zareh, A. Shahbazkhan, and A. Simchi, Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys. J. Alloy Compd. 688, 143 (2016).
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