Author:
Hamidnia M.,Luo Y.,Wang X.D.
Funder
State Key Development Program for Basic Research of China
Science Fund for Creative Research Groups of National Natural Science Foundation of China
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference125 articles.
1. Q. Pei, L. Qingqian, Y.C. Chan, Thermal analysis of high brightness flip-chip LED packages, 2011, 722–725.
2. Light emitting diodes reliability review;Chang;Microelectron. Reliab.,2012
3. B. Cao, S. Yu, H. Zheng, S. Liu, Silicon-based system in packaging for light emitting diodes, 2012, 1267–1271.
4. Copper-core MCPCB with thermal vias for high-power COB LED modules;Juntunen;IEEE Trans. Power Electron.,2014
5. Study on packaging method using silicon substrate with cavity and TSV for light emitting diodes;Lv;IEEE Trans. Compon. Packag. Manuf. Technol.,2013
Cited by
80 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献