Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference67 articles.
1. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014
2. Development of high-temperature solders: review;Zeng;Microelectron. Reliab.,2012
3. Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes;Chen;J. Alloys Compd.,2016
4. Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder;El-Daly;J. Alloys Compd.,2014
5. Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn;El-Daly;J. Alloys Compd.,2014
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