Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference23 articles.
1. Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder
2. Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance
3. Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders
4. IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms
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1. Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles;Materials Characterization;2024-06
2. Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder;Soldering & Surface Mount Technology;2024-04-30
3. Microstructure and orientation evolution of β-Sn and interfacial Cu6Sn5 IMC grains in SAC105 solder joints modified by Si3N4 nanowires;Journal of Materials Research and Technology;2023-09
4. Mechanical properties of Sn–Pb based solder joints and fatigue life prediction of PBGA package structure;Ceramics International;2023-08
5. Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates;Heliyon;2023-02
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