Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates-Reference-Cited by-同舟云学术

Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

Published:2023-02 Issue:2 Volume:9 Page:e12952
ISSN:2405-8440
Container-title:Heliyon
language:en
Short-container-title:Heliyon

Author:

Xiao Jin^ORCID,Tong Xing,Liang Jinhui,Chen Quankun,Tang Qiming

Publisher

Elsevier BV

Subject

Multidisciplinary

Reference35 articles.

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3. Effect of the soldering atmosphere on the wettability between Sn4.0Ag0.5Cu (in wt.%) lead-free solder paste and various substrates;Soares;J. Mater. Eng. Perform.,2018

4. Effect of small amount of Ni addition on microstructure and fatigue properties of Sn-Sb-Ag lead-free solder;Yamamoto;Materials,2021

5. Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly;Shalaby;Mater. Sci. Eng., A,2017

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