Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes
Author:
Funder
Ministry of Science and Technology of Taiwan
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference46 articles.
1. Tin–lead (SnPb) solder reaction in flip chip technology;Tu;Mater. Sci. Eng. R.,2001
2. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology;Jang;J. Appl. Phys.,1999
3. Influence of phosphorus content on the interfacial microstructure between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate;Mona;IEEE Trans. Adv. Packag.,2007
4. Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding;Strandjord;Microelectron. Reliab.,2002
5. The root causes of the “black pad” phenomenon and avoidance tactics;Suganuma;JOM,2008
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