Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.370627
Reference18 articles.
1. Future challenges in electronics packaging
2. Spalling of Cu6Sn5spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
3. The origins of stress in thin nickel films
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