Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions
Author:
Funder
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s13391-024-00491-2.pdf
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1. Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction;Materials;2024-07-25
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