Recent progress in SLID bonding in novel 3D-IC technologies-Reference-Cited by-同舟云学术

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Recent progress in SLID bonding in novel 3D-IC technologies

Published:2020-03 Issue: Volume:818 Page:152825
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Sun Lei^ORCID,Chen Ming-he,Zhang Liang,He Peng^ORCID,Xie Lan-sheng

Funder

National Natural Science Foundation of China

NUAA

Postgraduate Research & Practice Innovation Program of Jiangsu Province

Six Talent Peaks project in Jiangsu Province

Key project of State Key Laboratory of Advanced Welding and Joining

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference122 articles.

1. Microsystems using three-dimensional integration and TSV technologies: fundamentals and application;Wang;Microelectron. Eng.,2019

2. Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature;Xu;Ceram. Int.,2019

3. A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation;Wang;Appl. Surf. Sci.,2019

4. An air-plasma enhanced low-temperature wafer bonding method using high concentration water glass adhesive layer;Xu;Appl. Surf. Sci.,2020

5. Evaluations of heat treatment on polymer adhesive bonding and thermal-induced failure of two-layer through-silicon via structures;Han;Sens. Actuators A Phys.,2019

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4. Vertical Interconnections by Electroless Pd Atoms on Immersion Au Surface for Heterogeneous Integration;Journal of The Electrochemical Society;2024-07-01

5. Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures;Heliyon;2024-06

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