1. Piezoresistance effect in germanium and silicon;Smith;Phys. Rev.,1954
2. New MEMS sensor process by TSV technology for smaller packaging;Hirama,2015
3. M. Smith, et al. Methods of making thru-connections in semiconductor wafers, U.S. Patent 3,343,256, 1964.
4. K.P. Stuby, et al. Hourglass-shaped conductive connection through semiconductor structures. US Patent 3,648,131, 1969.