Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps-Reference-Cited by-同舟云学术

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

Published:2009-08-18 Issue:11 Volume:38 Page:2228-2233
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lim Gi-Tae,Kim Byoung-Joon,Lee Kiwook,Kim Jaedong,Joo Young-Chang,Park Young-Bae

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-009-0922-0.pdf

Reference24 articles.

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3. V. S. Rao, V. Kripseph, S.W. Yoon, D. Witarsa, and A.A.O. Tay, Proceedings of 6th Electronic Packing Technology Conference (IEEE, 2004), pp. 444–449.

4. H.Y. Son, G.J. Jung, B.J. Park, and K.W. Paik, J. Electron. Mater. 37, 1832 (2008).

5. H. Yamada, T. Togasaki, K. Tateyama, and K. Higuchi, Int. J. Microcirc. Electron. Packag. 21, 15 (1998).

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