A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates-Reference-Cited by-同舟云学术

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A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates

Published:2008-09-10 Issue:12 Volume:37 Page:1832-1842
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Son Ho-Young,Jung Gi-Jo,Park Byung-Jin,Paik Kyung-Wook

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-008-0498-0.pdf

Reference16 articles.

1. J.H. Lau, Flip Chip Technologies. New York: McGraw-Hill, (1996)

2. I.T.R.S. Roadmap, 2004 Update, http://public.itrs.net

3. T. Kawahara, IEEE T Adv. Pack. 23, 215 (2000)

4. F. Tung, US Patent 6,578,754 (2003)

5. H. Yamada, T. Tagasaki, K. Tateyama, and K. Higuchi, Proc. Int’l Symp. Microelectronics (1997), p.417

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