Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
37 articles.
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1. Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging;Journal of Electronic Packaging;2018-03-01
2. On-Chip Power Distribution Networks;On-Chip Power Delivery and Management;2016
3. Bump Interconnect for 2.5D and 3D Integration;Handbook of 3D Integration;2014-06-20
4. Thermal Stresses in Wafer-Level Packaging;Encyclopedia of Thermal Stresses;2014
5. Introduction;Power Distribution Networks with On-Chip Decoupling Capacitors;2010-11-06