1. Erickson CA. Wafer bumping: the missing link for DCA. Electronic Packaging and Production, July 1998. p. 43–6
2. Popelar S, Hazel S. Evaluation of FlipFET reliability based on solder fatigue modeling and a simulated design of experiment. Proceedings of 3rd Annual HDI Expo, Phoenix, Arizona, 25–27 September, 2000. p. 947–68
3. Popelar S, Roesch M. Flip chip reliability modeling based on solder fatigue as applied to flip chip on laminate assemblies. IMAPS Workshop on Flip Chip, Braselton, Georgia, 4–5 March, 2000
4. Popelar SF. A parametric study of flip chip reliability based on solder fatigue modeling: Part II - flip chip on organic. 31st International Symposium on Microelectronics Proceedings, 1998 IMAPS, San Diego, CA, November 1998. p. 497–504
5. Deltoro G, Sharif N. Copper interconnect: migration or bust. Proceedings 1999 IEMT Symposium, 18–19 October, 1999, Austin, Texas. p. 185–8