The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimental

Author:

Razizy F. Muhamad,Zhang N. Zhen,Hashim M. S.,Azlina O. Saliza,Azmir O. Shahrul

Publisher

Springer International Publishing

Reference58 articles.

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2. Berni, R. (2016). A comparison of alloy-surface finish combinations considering different component package types and their impact on soldering reliability. IEEE Transactions on Reliability, 65(1).

3. Bin, Y., & Yudong, L. (2013). Key failure modes of solder joints on HASL PCBs and root cause analysis, 742–745.

4. Bunce, M., Clark, L., & Swanson, J. (2017). A successful ENIG finished PCB under revision a of IPC 4552 MacDermid Enthone.

5. Chaillot, A., Venet, N., Tegehall, P.-E., Hokka, J., & Portal, J.-L. (2013). ENEPIG finish an alternative solution for space printed circuit boards (PCB). In 2013 European Microelectronics Packaging Conference (EMPC), September 9–12, Grenoble, France

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