Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection-Reference-Cited by-同舟云学术

Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection

Published:2022-10-04 Issue:10 Volume:4 Page:4966-4971
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Tian Liang¹,Lin Chang¹²,Pan Kui¹,Lu Yu¹,Deng Liying¹^ORCID,Huang Zhonghang¹²,Yang Tianxi¹²,Zhang Yongai¹²,Sun Jie¹²³^ORCID,Yan Qun¹²⁴

Affiliation:

1. National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou350100, China

2. Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou350100, China

3. Quantum Device Physics Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg41296, Sweden

4. Rich Sense Electronics Technology Co., Ltd., Jinjiang, Quanzhou362200, China

Funder

Ministry of Science and Technology of the People's Republic of China

Fujian Province

Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.2c00974

Reference26 articles.

1. III-Nitride full-scale high-resolution microdisplays

2. Fabrication and Characterization of Active-Matrix $960\times540$ Blue GaN-Based Micro-LED Display

3. Development of Metal Bonding for Passive Matrix Micro-LED Display Applications

4. 2000 PPI silicon-based AlGaInP red micro-LED arrays fabricated via wafer bonding and epilayer lift-off

5. Fabrication and Mechanical Properties Improvement of Micro Bumps for High-Resolution Micro-LED Display Application

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