Fabrication and Mechanical Properties Improvement of Micro Bumps for High-Resolution Micro-LED Display Application-Reference-Cited by-同舟云学术

Fabrication and Mechanical Properties Improvement of Micro Bumps for High-Resolution Micro-LED Display Application

Author:

Ji Xiaoxiao¹,Wang Fei²,Lin Pengsen³,Yin Luqiao¹^ORCID,Zhang Jianhua¹^ORCID

Affiliation:

1. Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, Shanghai, China

2. School of Microelectronics, Shanghai University, Shanghai, China

3. School of Materials Science and Engineering, Shanghai University, Shanghai, China

Funder

Science and Technology Commission of Shanghai Municipality Program

National Nature Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

Reference34 articles.

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3. Influences of bonding process parameters on mechanical properties of the Micro-LED device;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08