Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference22 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
3. Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations
4. Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating
5. The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces
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1. Evolution of Microstructure and Mechanical Properties of Copper Pillar Solder Joints Under Ultrasound;Journal of Electronic Materials;2022-10-12
2. Fabrication and Mechanical Properties Improvement of Micro Bumps for High-Resolution Micro-LED Display Application;IEEE Transactions on Electron Devices;2022-07
3. Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes;Science of Advanced Materials;2020-04-01
4. Review of microstructure and properties of low temperature lead-free solder in electronic packaging;Science and Technology of Advanced Materials;2020-01-31
5. Pb-free solder—microstructural, material reliability, and failure relationships;Handbook of Materials Failure Analysis;2020
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