The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni

The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces

Published:2005-03 Issue:3-4 Volume:45 Page:647-655
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kim K.S.,Ryu K.W.,Yu C.H.,Kim J.M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Lead free solders in microelectronics;Abtew;Mater. Sci. Eng.,2000

2. Evaluations of Interconnect Reliability with Sn–Zn Solder Balls. Hitachi Metals, Ltd, 2003

3. Microstructure and mechanical properties of Pb-free solder alloys of low-cost electronic assembly;Glazer;Electron. Mater.,1994

4. Practical use of lead-free tin–zinc–aluminum (Sn–Zn–Al) solder;Date;Fujitsu,2003

5. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng.,2002

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