Microstructure evolution and mechanical properties of Sn-9Zn-2.5Bi-1.5In solder joints with aging treatment under various conditions-Reference-Cited by-同舟云学术

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Microstructure evolution and mechanical properties of Sn-9Zn-2.5Bi-1.5In solder joints with aging treatment under various conditions

Published:2023-11 Issue: Volume:205 Page:113319
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Gong Shiliang,Chen Gaoqiang,Qu Songtao,Xu Xun,Duk Vichea,Shi Qingyu,Zhang Gong

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference44 articles.

1. Shear strengths and fracture behaviors of cu/Sn37Pb/Cu soldered joints subjected to different displacement rates;Hu;J. Alloys Compd.,2014

2. Comparison of wettability for Sn-based solders on copper and aluminum substrates;Yin;Mater. Sci. For.,2011

3. A review of lead-free solders for electronics applications;Cheng;Microelectron. Reliab.,2017

4. Structure and properties of Sn-Cu lead-free solders in electronics packaging;Zhao;Sci. Technol. Adv. Mater.,2019

5. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R,2005

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of temperature on joint quality in wave soldering of Sn-9Zn-2.5Bi-1.5In lead-free solder alloy;Microelectronic Engineering;2024-09

2. Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering;Soldering & Surface Mount Technology;2024-07-04

3. The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance;Soldering & Surface Mount Technology;2024-04-17

4. Effect of Different Concentrations of Co Doping on the Properties of η′‐Cu₆Sn₅ and Ni₃Sn₄: First‐Principles Study;physica status solidi (b);2024-04-16

5. Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding;Materials Today Communications;2024-03

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