Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding

Author:

Rajendran Sri Harini,Ku Jun Ho,Kang Jiwan,Jung Jae Pil

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference60 articles.

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2. Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball;Hwang;Appl. Surf. Sci.,2018

3. Comparative study of solder size and volume effect on properties of Sn–3.0Ag–0.5Cu joints during isothermal aging;Seo;J. Mater. Sci: Mater. Electron,2023

4. Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties;Zhong;Mater. Des.,2022

5. Effect of black residue on the mechanical properties of Sn-58Bi epoxy solder joints;Lee;Microelectron. Eng.,2019

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