Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding
Author:
Funder
University of Seoul
National Research Foundation of Korea
Ministry of Science, ICT and Future Planning
Publisher
Elsevier BV
Reference60 articles.
1. Automotive power module packaging: current status and future trends;Yang;IEEE Access,2020
2. Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball;Hwang;Appl. Surf. Sci.,2018
3. Comparative study of solder size and volume effect on properties of Sn–3.0Ag–0.5Cu joints during isothermal aging;Seo;J. Mater. Sci: Mater. Electron,2023
4. Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties;Zhong;Mater. Des.,2022
5. Effect of black residue on the mechanical properties of Sn-58Bi epoxy solder joints;Lee;Microelectron. Eng.,2019
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3