Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference36 articles.
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3. Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young’s modulus, hardness and deformation mechanisms as a function of temperature;Marques;Acta Mater.,2013
4. Joint strength and microstructure for Sn-Ag-(Cu) soldering on an electroless Ni-Au surface finish by using a flux containing a Cu compound;Kumamoto;J. Electron. Mater.,2008
5. Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint;Yoon;Microelectron. Reliab.,2008
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