Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young’s modulus, hardness and deformation mechanisms as a function of temperature
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference37 articles.
1. Implications of Pb-free microelectronics assembly in aerospace applications
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3. Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder
4. Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders
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