Second Generation Lead-free Solder Alloys – A Challenge to Thermodynamics-Reference-Cited by-同舟云学术

Second Generation Lead-free Solder Alloys – A Challenge to Thermodynamics

Published:2005-11 Issue:11 Volume:136 Page:1811-1821
ISSN:0026-9247
Container-title:Monatshefte für Chemie - Chemical Monthly
language:en
Short-container-title:Monatsh. Chem.

Author:

Plumbridge William J.

Publisher

Springer Science and Business Media LLC

Subject

General Chemistry

Link

http://link.springer.com/content/pdf/10.1007/s00706-005-0377-9.pdf

Reference15 articles.

1. COST ACTION. 531. Lead-free Solder Materials, http://www.ap.univie.ac.at/users/www.COST531

2. Plumbridge WJ, Matela RJ, Westwater A (2003) Structural Integrity and Reliability in Electronics – Enhancing Performance in a Lead-free Environment. Kluwer Academic Publishers, ch 1

3. Lead‐free reflow soldering for electronics assembly

4. Richards B, Levogner CL, Hunt CP, Nimmo K, Peters S, Cusack P (1999) Lead Free Soldering – An Analysis of the Current Status of Lead-free Soldering. DTI

5. Long term mechanical reliability with lead‐free solders

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