Solder joint failures under thermo-mechanical loading conditions – A review
Author:
Affiliation:
1. Department of Mechanical Engineering & Built Environment, College of Engineering & Technology, University of Derby, Derby, UK
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/2374068X.2020.1751514
Reference99 articles.
1. Ahmed S, Basit M, Suhling JC, P. Lall. “Effects of ageing on SAC-Bi solder materials,” 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas, NV, 2016, pp. 746-754.
2. Amalu EH. Modelling of the reliability of flip chip lead-free solder joints at high-temperature excursions. Amalu, Emeka Hyginus, Medway, Kent, 2012.
3. Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate
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