Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate

Author:

Kanlayasiri Kannachai,Sukpimai Kamtorn

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference41 articles.

1. Lead-free solder interconnect reliability;Shangguan;ASM Int.,2005

2. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R,2000

3. Impact of drop-in lead free solders on microelectronics packaging;Chew;Electro. Packag. Technol. Conf.,2005

4. High drop test reliability: Lead-free solders;Amagai;Electron. Compon. Technol. Conf.,2004

5. Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy;Kanlayasiri;J. Alloys Compd.,2009

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