Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate

Published:2016-05 Issue: Volume:668 Page:169-175
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Kanlayasiri Kannachai,Sukpimai Kamtorn

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference41 articles.

1. Lead-free solder interconnect reliability;Shangguan;ASM Int.,2005

2. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R,2000

3. Impact of drop-in lead free solders on microelectronics packaging;Chew;Electro. Packag. Technol. Conf.,2005

4. High drop test reliability: Lead-free solders;Amagai;Electron. Compon. Technol. Conf.,2004

5. Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy;Kanlayasiri;J. Alloys Compd.,2009

Cited by 49 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate;Soldering & Surface Mount Technology;2024-08-13

2. Effect of individual and synergistic alloying of In and Ni on microstructure, phase stability and thermal properties of lead-free Sn-0.7Cu solder;Philosophical Magazine;2024-07-29

3. Evaluation of the microstructure, distribution of the intermetallic compounds, and mechanical behavior of SC07 solders with In, Ni, and TiO2 NPs minor additions;Journal of Materials Science: Materials in Electronics;2024-05

4. Effects of In and aging treatment on the microstructure, mechanical properties and electrochemical corrosion behavior of Sn 2Cu solder alloy;Materials Characterization;2024-03

5. Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint;Journal of Materials Science: Materials in Electronics;2024-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3