Effect of individual and synergistic alloying of In and Ni on microstructure, phase stability and thermal properties of lead-free Sn-0.7Cu solder-Reference-Cited by-同舟云学术

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Effect of individual and synergistic alloying of In and Ni on microstructure, phase stability and thermal properties of lead-free Sn-0.7Cu solder

Published:2024-07-29 Issue: Volume: Page:1-23
ISSN:1478-6435
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

Thakur Ayushi¹,Jain Jayant¹,Santra Sangeeta¹

Affiliation:

1. Department of Materials Science and Engineering, Indian Institute of Technology, Delhi, India

Funder

Science and Engineering Research Board

Department of Science and Technology

PMRF

SERB

IITD

SEED

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/14786435.2024.2383771

Reference57 articles.

1. Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys

2. The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

3. The effect of the size of NbTi filaments on interfacial reactions and the properties of InSn-based superconducting solder joints

4. Phase Evolution in the AuCu/Sn System by Solid-State Reactive Diffusion

5. Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

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