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The effect of the size of NbTi filaments on interfacial reactions and the properties of InSn-based superconducting solder joints

  • Published:2019-08 Issue: Volume:176 Page:107836
  • ISSN:0264-1275
  • Container-title:Materials & Design
  • language:en
  • Short-container-title:Materials & Design

Author:

Santra S.,Davies T.,Matthews G.,Liu J.,Grovenor C.R.M.,Speller S.C.

Funder

Royal Society-SERB Newton International Fellowship

EPSRC

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference51 articles.

1. Persistent current joints between technological superconductors;Brittles;Supercond. Sci. Technol.,2015

2. Analysis for formation of current path in the superconducting joint between Nb-Ti wires with the solder matrix replacement method;Kodama;Supercond. Sci. Technol.,2015

3. Superconducting joint and persistent current switch for a 7-Tanimal MRI magnet;Liu;IEEE Trans. Appl. Supercond.,2013

4. Official Journal of the European Union, Directive 2014/9/EU,2014

5. Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin-bismuth-silver (Sn-Bi-Ag) solder on copper (Cu) substrate;Gain;J. Mater. Sci. Mater. Electron.,2016
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