Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Author:

Xiong Ming-yueORCID,Zhang LiangORCID

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference136 articles.

1. Tan AT, Tan AW, Yusof F (2015) Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions. Sci Technol Adv Mater 16(3):033505

2. Xu T, Hu X, Li Y et al (2017) The growth behavior of interfacial intermetallic compound between Sn–3.5 Ag–0.5 Cu solder and Cu substrate under different thermal-aged conditions. J Mater Sci: Mater Electron 28(24):18515–18528

3. Yang M, Li M, Kim J (2012) Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging. Intermetallics 31:177–185

4. Xue P, Xue S, Shen Y et al (2012) Study on properties of Sn–9Zn–Ga solder bearing Nd. J Mater Sci: Mater Electron 23(6):1272–1278

5. Zhang L, Cui J, Han J et al (2014) Finite element analysis of SnAgCu (Zn Co, Fe) lead-free solder joints for electronic packaging. Int J Nonlinear Sci Numer Simul 15(3–4):197–206

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