Precipitation processes and phase interface structure of Ag3Sn during solidification of SnAg3Cu0.5/Cu solder joint
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference42 articles.
1. Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging;Xiong;J. Mater. Sci.,2019
2. Influence mechanism of Au layer thickness on wettability of Sn–Ag–Cu solder on heated ENIG pads;Wang;Vacuum,2022
3. Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs;Qiu;Vacuum,2020
4. Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder;Lee;J. Alloys Compd.,2011
5. Effects of the melt state on the microstructure of a Sn–3.5%Ag solder at different cooling rates;Li;Appl. Surf. Sci.,2012
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