Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. ESPEC Technology Report, 1, 2002.
2. Lead-free Solders in Microelectronics
3. Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy
4. Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties
5. Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
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