Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference23 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu Near Eutectic Alloys
3. Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
4. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
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