Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference23 articles.
1. Tin-silver-copper eutectic temperature and composition
2. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
3. Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys
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