Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints-Reference-Cited by-同舟云学术

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Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

Published:2003-03 Issue:1-2 Volume:352 Page:226-236
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Kim K.S.,Huh S.H.,Suganuma K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference23 articles.

1. Tin-silver-copper eutectic temperature and composition

2. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

3. Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys

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4. Reliability Evaluations of Bonding Characteristics of Combined Pb-free Solder Joints with Sn-Bi-Ag and Sn-Ag-Cu;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

5. Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints;Journal of Materials Science: Materials in Electronics;2024-04

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