Influence mechanism of Au layer thickness on wettability of Sn–Ag–Cu solder on heated ENIG pads
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference31 articles.
1. Reactive wetting in metal/metal systems: dissolutive versus compound-forming systems;Yin;Mater. Sci. Eng., A,2008
2. Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock;Tian;J. Mater. Sci. Mater. Electron.,2021
3. Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder;Lee;Microelectron. Reliab.,2018
4. Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test;Mo;J. Mater. Sci. Mater. Electron.,2018
5. Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging;Yoon;Microelectron. Eng.,2006
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