Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
Author:
Funder
Universiti Tenaga Nasional
Tenaga Nasional Berhad
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference200 articles.
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3. Influences of Ni addition into Cu–x Ni alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–x Ni solder joint;Cheng;Appl Phys A,2020
4. Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles;Zhao;J Mater Sci Mater Electron,2019
5. A modular solder system with hierarchical morphology and backward compatibility;Lee;Small,2018
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