Funder
National Key R&D Program of China
Natural Science Foundation of China
Key project of State Key Laboratory of Advanced Welding and Joining
Six Talent Peaks Project in Jiangsu Province
the Qing Lan Project, the China Postdoctoral Science Foundation funded project
International Cooperation Project
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. L. Zhang, Z. Liu, S. Chen et al., Materials, processing and reliability of low temperature bonding in 3D chip stacking. J. Alloys Compd. 750, 980–995 (2018)
2. K.N. Tu, H. Hsiao, C. Chen, Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy. Microelectron. Reliab. 53(1), 2–6 (2013)
3. B. Lee, S. Hyun, J. Yoon, Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging. J. Mater. Sci. 28(11), 7827–7833 (2017)
4. J.F. Li, P.A. Agyakwa, C.M. Johnson, Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process. Acta Mater. 58(9), 3429–3443 (2010)
5. M.S. Park, S.L. Gibbons, R. Arróyave, Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions. Acta Mater. 60(18), 6278–6287 (2012)
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献