Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Cited by 150 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Improvement of heat aging resistance and tensile strength of SAC305/Cu solder joints by multi-element microalloying;Intermetallics;2024-10
2. Asymmetric growth of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system under the vertical ultrasonic vibration;Intermetallics;2024-07
3. Kinetics of initial diffusion solidification during continuous heating in term of IN718 superalloy / 316LN steel TLP bonding system;Materialia;2024-05
4. Reactive diffusion at the interface between Cu and Sn–Ag alloys;Journal of Materials Research and Technology;2024-05
5. A Comparative Numerical Study of Thermo-Mechanical Behavior among Various IMC Joints under Thermal Cycling Condition;Journal of Smart Processing;2024-03-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3