Improvement of heat aging resistance and tensile strength of SAC305/Cu solder joints by multi-element microalloying
Author:
Funder
Applied Basic Research Foundation of Yunnan Province
Yunnan Applied Basic Research Project
Publisher
Elsevier BV
Reference49 articles.
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3. Development of Sn–Zn lead-free solders bearing alloying elements;Zhang;J. Mater. Sci. Mater. Electron.,2009
4. Investigations of wetting properties of Ni–V and Ni–Co alloys by Sn, Sn–Pb, Sn–Cu, and Sn–Ag–Cu solders;Fu;J. Taiwan Inst. Chem. Eng.,2011
5. Early stage growth characteristics of Ag3Sn intermetallic compounds during solid-solid and solid-liquid reactions in the Ag-Sn interlayer system: experiments and simulations;Lis;J. Alloys Compd.,2014
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